JAN1N1204RA: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 1.253 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), special_features: WEAPON SYSTEM ESSENTIAL, features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.190 INCHES IN. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-226-3719, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 1.253 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| special_features | WEAPON SYSTEM ESSENTIAL |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.190 INCHES IN |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN |
| terminal_type_and_quantity | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| specification/standard_data | 81349-MIL-S-19500/260 GOVERNMENT SPECIFICATION |
| criticality_code_justification | FEAT |
| NSN | 5961-00-226-3719 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 480.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS CASE DEGC |
| MOUNTING FACILITY QUANTITY | 1 |
| MOUNTING METHOD | THREADED STUD(S) |
| OVERALL LENGTH | 0.405 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL WIDTH ACROSS FLATS | 0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN |
| NOMINAL THREAD SIZE | 0.190 INCHES IN |
| CURRENT RATING PER CHARACTERISTIC | 240.00 AMPERES MAXIMUM FORWARD CURRENT, DC |
| SPECIFICATION/STANDARD DATA | 81349-MIL-S-19500/260 GOVERNMENT SPECIFICATION |