ITT9002-1B — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ITT9002-1B: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-032-6849, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ITT9002-1B

NSN: 5962-01-032-6849
FSC: 5962 — Microcircuits, Electronic
CAGE: 14433 — ITT SEMICONDUCTORS DIV (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.050 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN
body_length	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	QUAD 2 INPUT
end_item_identification	NAVIGATION-DISPLAY SET TYPE AN/ASN-124 FSCM 35351
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-032-6849

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: QUAD 2 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 4 GATE, NAND

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.050 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	QUAD 2 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	4 GATE, NAND
BODY WIDTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
BODY HEIGHT	0.050 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
BODY LENGTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 5

HL54651Reference document

Same NSN cross-reference

Reference document — Secondary reference

NC6508Reference document

Same NSN cross-reference

Reference document — Secondary reference

DMS 83012BReference document

Same NSN cross-reference

Reference document — Secondary reference

M235A108-21Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

9002FMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is ITT9002-1B?

ITT9002-1B is a MICROCIRCUIT,DIGITAL.

What parts can replace ITT9002-1B?

There are 5 known substitutes for ITT9002-1B: HL54651, NC6508, DMS 83012B and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for ITT9002-1B?

ITT9002-1B is cataloged in the U.S. Government catalog under NSN 5962-01-032-6849. This indicates validated use in U.S. government and defense supply chains.

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ITT9002-1B — MICROCIRCUIT,DIGITAL

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