ISO100AP — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ISO100AP: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.490 INCHES MINIMUM AND 0.510 INCHES MAXIMUM IN, body_height: 0.190 INCHES MINIMUM AND 0.235 INCHES MAXIMUM IN, body_length: 0.990 INCHES MINIMUM AND 1.010 INCHES MAXIMUM IN, features_provided: LOW DRIFT AND OPTICALLY COUPLED AND WIDEBAND, inclosure_material: PLASTIC, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-199-2888, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ISO100AP

NSN: 5962-01-199-2888
FSC: 5962 — Microcircuits, Electronic
CAGE: 13919 — BURR-BROWN CORP (USA)

SPECIFICATIONS

body_width	0.490 INCHES MINIMUM AND 0.510 INCHES MAXIMUM IN
body_height	0.190 INCHES MINIMUM AND 0.235 INCHES MAXIMUM IN
body_length	0.990 INCHES MINIMUM AND 1.010 INCHES MAXIMUM IN
features_provided	LOW DRIFT AND OPTICALLY COUPLED AND WIDEBAND
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-55.0 TO 100.0 CELSIUS DEGC
operating_temp_range	-25.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	DUAL 2 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
voltage_rating_and_type_per_characteristic	15.0 VOLTS MAXIMUM POWER SOURCE
NSN	5962-01-199-2888

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: DUAL 2 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.490 INCHES MINIMUM AND 0.510 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.190 INCHES MINIMUM AND 0.235 INCHES MAXIMUM IN

•

FEATURES PROVIDED: LOW DRIFT AND OPTICALLY COUPLED AND WIDEBAND

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	DUAL 2 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.490 INCHES MINIMUM AND 0.510 INCHES MAXIMUM IN
BODY HEIGHT	0.190 INCHES MINIMUM AND 0.235 INCHES MAXIMUM IN
FEATURES PROVIDED	LOW DRIFT AND OPTICALLY COUPLED AND WIDEBAND
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.990 INCHES MINIMUM AND 1.010 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 100.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is ISO100AP?

ISO100AP is a MICROCIRCUIT,MEMORY.

What is the NSN for ISO100AP?

ISO100AP is cataloged in the U.S. Government catalog under NSN 5962-01-199-2888. This indicates validated use in U.S. government and defense supply chains.

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ISO100AP — MICROCIRCUIT,MEMORY

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