IMS1600W-70M — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IMS1600W-70M: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.296 INCHES MAXIMUM IN, body_height: 0.080 INCHES MAXIMUM IN, body_length: 0.496 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-291-5580, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IMS1600W-70M

NSN: 5962-01-291-5580
FSC: 5962 — Microcircuits, Electronic
CAGE: 60911 — SGS-THOMSON MICROELECTRONICS INC (USA)

SPECIFICATIONS

body_width	0.296 INCHES MAXIMUM IN
body_height	0.080 INCHES MAXIMUM IN
body_length	0.496 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-291-5580

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.296 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.080 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.296 INCHES MAXIMUM IN
BODY HEIGHT	0.080 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.496 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 4

IMS1600N-70MReference document

Same NSN cross-reference

Reference document — Secondary reference

IMS1601W-70MReference document

Same NSN cross-reference

Reference document — Secondary reference

SCD3000Reference document

Same NSN cross-reference

Reference document — Secondary reference

1601LMQB70Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is IMS1600W-70M?

IMS1600W-70M is a MICROCIRCUIT,MEMORY.

What parts can replace IMS1600W-70M?

There are 4 known substitutes for IMS1600W-70M: IMS1600N-70M, IMS1601W-70M, SCD3000 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for IMS1600W-70M?

IMS1600W-70M is cataloged in the U.S. Government catalog under NSN 5962-01-291-5580. This indicates validated use in U.S. government and defense supply chains.

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