The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.260 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.900 INCHES MAXIMUM IN, bit_quantity: 4096, word_quantity: 1024, features_provided: STATIC OPERATION. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-102-9768, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.260 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| body_length | 0.900 INCHES MAXIMUM IN |
| bit_quantity | 4096 |
| word_quantity | 1024 |
| features_provided | STATIC OPERATION |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 12 INPUT |
| NSN | 5962-01-102-9768 |
| BODY WIDTH | 0.260 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY LENGTH | 0.900 INCHES MAXIMUM IN |
| BIT QUANTITY | 4096 |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| WORD QUANTITY | 1024 |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| MEMORY DEVICE TYPE | RAM |