IM5610 — MICROCIRCUIT,MEMORY

✓ Government record, cited

Ewent · COMPONENT

PRODUCT OVERVIEW

IM5610: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a Ewent memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-131-7935, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IM5610

NSN: 5962-01-131-7935
NIINs: 011317935, 011733230
FSC: 5962 — Microcircuits, Electronic
CAGE: 32293 — INTERSIL INC SUB OF GENERAL ELECTRIC CO (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	0.840 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
NSN	5962-01-131-7935

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND HIGH SPEED AND BIPOLAR AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND HIGH SPEED AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	0.840 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROM FAMILY 013Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is IM5610?

IM5610 is a MICROCIRCUIT,MEMORY manufactured by Ewent.

What parts can replace IM5610?

There is 1 known substitute for IM5610: ROM/PROM FAMILY 013. Substitute compatibility should be verified for your specific system.

What is the NSN for IM5610?

IM5610 is cataloged in the U.S. Government catalog under NSN 5962-01-131-7935. This indicates validated use in U.S. government and defense supply chains.

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IM5610 — MICROCIRCUIT,MEMORY

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