IDT7204L50LB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT7204L50LB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.458 INCHES MAXIMUM IN, body_height: 0.086 INCHES MAXIMUM IN, body_length: 0.558 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIDIRECTIONAL AND HIGH PERFORMANCE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-302-6192, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT7204L50LB

NSN: 5962-01-302-6192
NIINs: 013026192, 014581786
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	0.458 INCHES MAXIMUM IN
body_height	0.086 INCHES MAXIMUM IN
body_length	0.558 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND BIDIRECTIONAL AND HIGH PERFORMANCE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	FIRST-IN FIRST-OUT
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
end_item_identification	RADAR SET DCN
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-302-6192

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.458 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.086 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND BIDIRECTIONAL AND HIGH PERFORMANCE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: FIRST-IN FIRST-OUT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.458 INCHES MAXIMUM IN
BODY HEIGHT	0.086 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND BIDIRECTIONAL AND HIGH PERFORMANCE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	FIRST-IN FIRST-OUT
BODY LENGTH	0.558 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

CY7C433-40LMBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is IDT7204L50LB?

IDT7204L50LB is a MICROCIRCUIT,MEMORY.

What parts can replace IDT7204L50LB?

There is 1 known substitute for IDT7204L50LB: CY7C433-40LMB. Substitute compatibility should be verified for your specific system.

What is the NSN for IDT7204L50LB?

IDT7204L50LB is cataloged in the U.S. Government catalog under NSN 5962-01-302-6192. This indicates validated use in U.S. government and defense supply chains.

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