IDT7202LA30DB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT7202LA30DB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND PARALLEL OPERATION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-366-3039, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT7202LA30DB

NSN: 5962-01-366-3039
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND PARALLEL OPERATION
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	FIRST-IN FIRST-OUT
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-366-3039

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.217 INCHES MAXIMUM IN

•

CAPITANCE RATING PER CHARACTERISTIC: 8.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM

•

FEATURES PROVIDED: MONOLITHIC AND PARALLEL OPERATION

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.217 INCHES MAXIMUM IN
CAPITANCE RATING PER CHARACTERISTIC	8.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM
FEATURES PROVIDED	MONOLITHIC AND PARALLEL OPERATION
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	50.00 MILLIAMPERES MAXIMUM OUTPUT
MEMORY DEVICE TYPE	FIRST-IN FIRST-OUT

SUBSTITUTES & CROSS-REFERENCES 4

5962-89536Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-8953605YBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8953605YXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8953605YASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is IDT7202LA30DB?

IDT7202LA30DB is a MICROCIRCUIT,MEMORY.

What parts can replace IDT7202LA30DB?

There are 4 known substitutes for IDT7202LA30DB: 5962-89536, 5962-8953605YB, 5962-8953605YX and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for IDT7202LA30DB?

IDT7202LA30DB is cataloged in the U.S. Government catalog under NSN 5962-01-366-3039. This indicates validated use in U.S. government and defense supply chains.

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