IDT7133SA55GB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT7133SA55GB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 1.180 INCHES MAXIMUM IN, body_height: 0.070 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN, body_length: 1.180 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-417-3745, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT7133SA55GB

NSN: 5962-01-417-3745
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	1.180 INCHES MAXIMUM IN
body_height	0.070 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN
body_length	1.180 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	PIN GRID ARRAY
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	68 PIN
NSN	5962-01-417-3745

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 1.180 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.070 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: PIN GRID ARRAY

•

CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES MAXIMUM SUPPLY

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	1.180 INCHES MAXIMUM IN
BODY HEIGHT	0.070 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	PIN GRID ARRAY
CURRENT RATING PER CHARACTERISTIC	50.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.180 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

5962-88610Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-8861011ZXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8861011ZASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-8861011ZBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is IDT7133SA55GB?

IDT7133SA55GB is a MICROCIRCUIT,MEMORY.

What parts can replace IDT7133SA55GB?

There are 4 known substitutes for IDT7133SA55GB: 5962-88610, 5962-8861011ZX, 5962-8861011ZA and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for IDT7133SA55GB?

IDT7133SA55GB is cataloged in the U.S. Government catalog under NSN 5962-01-417-3745. This indicates validated use in U.S. government and defense supply chains.

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