IDT71256L100TCB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT71256L100TCB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 1.485 INCHES MAXIMUM IN, memory_capacity: 32KX8 SRAM, inclosure_material: CERAMIC, memory_device_type: RAM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-399-0678, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT71256L100TCB

NSN: 5962-01-399-0678
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.145 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
body_length	1.485 INCHES MAXIMUM IN
memory_capacity	32KX8 SRAM
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_type	MONOLITHIC
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
time_rating_per_chacteristic	45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY NS
NSN	5962-01-399-0678

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.145 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 1.485 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.145 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.485 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	6.0 VOLTS MAXIMUM INPUT

SUBSTITUTES & CROSS-REFERENCES 4

5962-8855201UBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-88552Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-8855201UXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8855201UASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is IDT71256L100TCB?

IDT71256L100TCB is a MICROCIRCUIT,MEMORY.

What parts can replace IDT71256L100TCB?

There are 4 known substitutes for IDT71256L100TCB: 5962-8855201UB, 5962-88552, 5962-8855201UX and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for IDT71256L100TCB?

IDT71256L100TCB is cataloged in the U.S. Government catalog under NSN 5962-01-399-0678. This indicates validated use in U.S. government and defense supply chains.

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