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IDT7025L55GB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

IDT7025L55GB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN, body_height: 0.077 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN, body_length: 1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN, bit_quantity: 131072, special_features: ACCESS SPEED 55.0 NANOSECONDS NS, features_provided: BURN IN, MIL-STD-883, CLASS B AND HIGH SPEED AND LOW POWER AND STATIC OPERATION AND 3-STATE OUTPUT. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-446-8792, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
IDT7025L55GB
NSN: 5962-01-446-8792
NIINs: 014468792, 014505690
FSC: 5962 — Microcircuits, Electronic
CAGE: 51772 — INSTA-LETTERING MACHINE CO DBA INSTA GRAPHIC SYSTEMS (USA)
SPECIFICATIONS
body_width1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN
body_height0.077 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN
body_length1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN
bit_quantity131072
special_featuresACCESS SPEED 55.0 NANOSECONDS NS
features_providedBURN IN, MIL-STD-883, CLASS B AND HIGH SPEED AND LOW POWER AND STATIC OPERATION AND 3-STATE OUTPUT
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationPIN GRID ARRAY
terminal_type_and_quantity84 PIN
NSN5962-01-446-8792
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN IDT7025L55GB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 131072
•
INCLOSURE MATERIAL: CERAMIC
•
BODY WIDTH: 1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.077 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN
•
INCLOSURE CONFIGURATION: PIN GRID ARRAY
•
MEMORY DEVICE TYPE: RAM
•
BODY LENGTH: 1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN
•
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY131072
INCLOSURE MATERIALCERAMIC
BODY WIDTH1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN
BODY HEIGHT0.077 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONPIN GRID ARRAY
MEMORY DEVICE TYPERAM
BODY LENGTH1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.0 VOLTS NOMINAL POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is IDT7025L55GB?
IDT7025L55GB is a MICROCIRCUIT,MEMORY.
What is the NSN for IDT7025L55GB?
IDT7025L55GB is cataloged in the U.S. Government catalog under NSN 5962-01-446-8792. This indicates validated use in U.S. government and defense supply chains.
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