IDT7025L35GB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT7025L35GB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN, body_height: 0.077 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN, body_length: 1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN, special_features: DUAL PORT, features_provided: LOW POWER AND CASCADABLE AND ASYNCHRONOUS AND HIGH SPEED AND BIDIRECTIONAL AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-373-9123, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT7025L35GB

NSN: 5962-01-373-9123
NIINs: 013739123, 014313220
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN
body_height	0.077 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN
body_length	1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN
special_features	DUAL PORT
features_provided	LOW POWER AND CASCADABLE AND ASYNCHRONOUS AND HIGH SPEED AND BIDIRECTIONAL AND W/ENABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	27 INPUT AND 50 INPUT
NSN	5962-01-373-9123

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 27 INPUT AND 50 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.077 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN

•

CAPITANCE RATING PER CHARACTERISTIC: 11.00 INPUT PICOFARADS MAXIMUM AND 11.00 OUTPUT PICOFARADS MAXIMUM

•

FEATURES PROVIDED: LOW POWER AND CASCADABLE AND ASYNCHRONOUS AND HIGH SPEED AND BIDIRECTIONAL AND W/ENABLE

•

INCLOSURE CONFIGURATION: PIN GRID ARRAY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	27 INPUT AND 50 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	1.180 INCHES MINIMUM AND 1.235 INCHES MAXIMUM IN
BODY HEIGHT	0.077 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN
CAPITANCE RATING PER CHARACTERISTIC	11.00 INPUT PICOFARADS MAXIMUM AND 11.00 OUTPUT PICOFARADS MAXIMUM
FEATURES PROVIDED	LOW POWER AND CASCADABLE AND ASYNCHRONOUS AND HIGH SPEED AND BIDIRECTIONAL AND W/ENABLE
INCLOSURE CONFIGURATION	PIN GRID ARRAY
CURRENT RATING PER CHARACTERISTIC	50.00 MILLIAMPERES MAXIMUM OUTPUT
MEMORY DEVICE TYPE	RAM

SUBSTITUTES & CROSS-REFERENCES 1

IDT7025L45GBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is IDT7025L35GB?

IDT7025L35GB is a MICROCIRCUIT,MEMORY.

What parts can replace IDT7025L35GB?

There is 1 known substitute for IDT7025L35GB: IDT7025L45GB. Substitute compatibility should be verified for your specific system.

What is the NSN for IDT7025L35GB?

IDT7025L35GB is cataloged in the U.S. Government catalog under NSN 5962-01-373-9123. This indicates validated use in U.S. government and defense supply chains.

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