IDT7006S45GB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT7006S45GB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 1.870 INCHES MAXIMUM IN, body_height: 0.145 INCHES MAXIMUM IN, body_length: 1.870 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-412-8352, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT7006S45GB

NSN: 5962-01-412-8352
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	1.870 INCHES MAXIMUM IN
body_height	0.145 INCHES MAXIMUM IN
body_length	1.870 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	PIN GRID ARRAY
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	68 PIN
NSN	5962-01-412-8352

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 1.870 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.145 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: PIN GRID ARRAY

•

CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES NOMINAL OUTPUT

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	1.870 INCHES MAXIMUM IN
BODY HEIGHT	0.145 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	PIN GRID ARRAY
CURRENT RATING PER CHARACTERISTIC	50.00 MILLIAMPERES NOMINAL OUTPUT
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.870 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 4

5962-91508Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-9150805MXXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-9150805MXBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-9150805MXASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is IDT7006S45GB?

IDT7006S45GB is a MICROCIRCUIT,MEMORY.

What parts can replace IDT7006S45GB?

There are 4 known substitutes for IDT7006S45GB: 5962-91508, 5962-9150805MXX, 5962-9150805MXB and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for IDT7006S45GB?

IDT7006S45GB is cataloged in the U.S. Government catalog under NSN 5962-01-412-8352. This indicates validated use in U.S. government and defense supply chains.

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