IDT6168SA55DB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT6168SA55DB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, overall_height: 0.400 INCHES NOMINAL IN, memory_capacity: UNKNOWN, features_provided: MONOLITHIC AND STATIC OPERATION AND W/ENABLE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-254-2667, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT6168SA55DB

NSN: 5962-01-254-2667
NIINs: 012542667, 012621280, 013207873
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
overall_height	0.400 INCHES NOMINAL IN
memory_capacity	UNKNOWN
features_provided	MONOLITHIC AND STATIC OPERATION AND W/ENABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
precious_material	GOLD
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-254-2667

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.210 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND W/ENABLE AND 3-STATE OUTPUT AND BIDIRECTIONAL

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.210 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND W/ENABLE AND 3-STATE OUTPUT AND BIDIRECTIONAL
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.970 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

Ready to buy IDT6168SA55DB?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is IDT6168SA55DB?

IDT6168SA55DB is a MICROCIRCUIT,MEMORY.

What is the NSN for IDT6168SA55DB?

IDT6168SA55DB is cataloged in the U.S. Government catalog under NSN 5962-01-254-2667. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

IDT6168SA55DB — MICROCIRCUIT,MEMORY

Request a Quote — IDT6168SA55DB