IDT6168L55DB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT6168L55DB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.125 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN, body_length: 0.935 INCHES MINIMUM AND 0.970 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND LOW POWER, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-248-3547, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT6168L55DB

NSN: 5962-01-248-3547
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.125 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN
body_length	0.935 INCHES MINIMUM AND 0.970 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND LOW POWER
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	18 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-248-3547

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 18 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.125 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND LOW POWER

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	18 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.125 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND LOW POWER
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.935 INCHES MINIMUM AND 0.970 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

7916334-05Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

IDT6168LA55DBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is IDT6168L55DB?

IDT6168L55DB is a MICROCIRCUIT,MEMORY.

What parts can replace IDT6168L55DB?

There are 2 known substitutes for IDT6168L55DB: 7916334-05, IDT6168LA55DB. Substitute compatibility should be verified for your specific system.

What is the NSN for IDT6168L55DB?

IDT6168L55DB is cataloged in the U.S. Government catalog under NSN 5962-01-248-3547. This indicates validated use in U.S. government and defense supply chains.

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