IDT6116LA55TDB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT6116LA55TDB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, overall_width: 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, special_features: NUCLEAR HARDNESS CRITICAL ITEM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-349-4309, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT6116LA55TDB

NSN: 5962-01-349-4309
NIINs: 013494309, 013498091
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.280 INCHES MAXIMUM IN
overall_width	0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM IN
overall_height	0.400 INCHES MAXIMUM IN
special_features	NUCLEAR HARDNESS CRITICAL ITEM
features_provided	BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND STATIC OPERATION
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-55.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-349-4309

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 19 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: MONOLITHIC AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	19 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	MONOLITHIC AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
CASE OUTLINE SOURCE AND DESIGNATOR	D-9 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 1

NH312A4843P1Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is IDT6116LA55TDB?

IDT6116LA55TDB is a MICROCIRCUIT,MEMORY.

What parts can replace IDT6116LA55TDB?

There is 1 known substitute for IDT6116LA55TDB: NH312A4843P1. Substitute compatibility should be verified for your specific system.

What is the NSN for IDT6116LA55TDB?

IDT6116LA55TDB is cataloged in the U.S. Government catalog under NSN 5962-01-349-4309. This indicates validated use in U.S. government and defense supply chains.

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IDT6116LA55TDB — MICROCIRCUIT,MEMORY

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