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IDT54FBT2240LB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

IDT54FBT2240LB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, input_circuit_pattern: 3 STAGE, end_item_identification: 4920-01-317-8335, inclosure_configuration: LEADLESS FLAT PACK. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-397-1464, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
IDT54FBT2240LB
NSN: 5962-01-397-1464
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)
SPECIFICATIONS
output_logic_formBIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_materialCERAMIC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern3 STAGE
end_item_identification4920-01-317-8335
inclosure_configurationLEADLESS FLAT PACK
terminal_type_and_quantity20 LEADLESS
voltage_rating_and_type_per_characteristic4.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-397-1464
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN IDT54FBT2240LB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 3 STAGE
•
INCLOSURE MATERIAL: CERAMIC
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 4.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 20 LEADLESS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN3 STAGE
INCLOSURE MATERIALCERAMIC
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
OUTPUT LOGIC FORMBIPOLAR METAL-OXIDE SEMICONDUCTOR
VOLTAGE RATING AND TYPE PER CHARACTERISTIC4.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
END ITEM IDENTIFICATION4920-01-317-8335
TERMINAL TYPE AND QUANTITY20 LEADLESS
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 2
8519844-740Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
QS54FCT2240ATLBSame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is IDT54FBT2240LB?
IDT54FBT2240LB is a MICROCIRCUIT,MEMORY.
What parts can replace IDT54FBT2240LB?
There are 2 known substitutes for IDT54FBT2240LB: 8519844-740, QS54FCT2240ATLB. Substitute compatibility should be verified for your specific system.
What is the NSN for IDT54FBT2240LB?
IDT54FBT2240LB is cataloged in the U.S. Government catalog under NSN 5962-01-397-1464. This indicates validated use in U.S. government and defense supply chains.
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