The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.115 INCHES MINIMUM AND 0.160 INCHES MAXIMUM IN, body_length: 0.735 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND W/RESISTOR AND POSITIVE OUTPUTS, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-171-2150, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.115 INCHES MINIMUM AND 0.160 INCHES MAXIMUM IN |
| body_length | 0.735 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND W/RESISTOR AND POSITIVE OUTPUTS |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 4 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-171-2150 |
| DESIGN FUNCTION AND QUANTITY | 1 TIMER |
| INPUT CIRCUIT PATTERN | 2 INPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY LENGTH | 0.780 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| FEATURES PROVIDED | HERMETICALLY SEALED |
| INCLOSURE MATERIAL | CERAMIC |