HSMP-3834-BLKG: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON ALLOY SEMICONDUCTOR, overall_width: 1.150 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN, overall_height: 0.790 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, overall_length: 2.730 INCHES MINIMUM AND 3.130 INCHES MAXIMUM IN, special_features: MAX. SOLDERING TEMP.
260 DEG. C FOR 5 SEC.. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-548-8865, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON ALLOY SEMICONDUCTOR |
| overall_width | 1.150 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN |
| overall_height | 0.790 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN |
| overall_length | 2.730 INCHES MINIMUM AND 3.130 INCHES MAXIMUM IN |
| special_features | MAX. SOLDERING TEMP. 260 DEG. C FOR 5 SEC. |
| NSN | 5961-01-548-8865 |
| OVERALL HEIGHT | 0.790 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN |
| OVERALL LENGTH | 2.730 INCHES MINIMUM AND 3.130 INCHES MAXIMUM IN |
| OVERALL WIDTH | 1.150 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN |
| SPECIAL FEATURES | MAX. SOLDERING TEMP. 260 DEG. C FOR 5 SEC. |
| MATERIAL | SILICON ALLOY SEMICONDUCTOR |
No substitute or cross-reference records for this part.