HSMG-C150: LIGHT EMITTING DIODE.
The LIGHT EMITTING DIODE is a the manufacturer industrial component. Key specifications include overall_width: 3.2 MILLIMETERS NOMINAL MM, overall_height: 1.6 MILLIMETERS NOMINAL MM, special_features: OP TEMP: -30 DEG TO 85 DEG C; VARIUOS COLORS; DIFFUSED OPTICS; COMPATIBLE WITH IR SOLDER DEGC, lens_transparency: TRANSPARENT, end_item_identification: BACKLIGHTING APPLICATIONS AND FRONT PANEL ILLUMINATION, part_name_assigned_by_controlling_agency: SURFACE MOUNT CHIP LEDS. This part is cataloged in the U.S.
Government catalog under NSN 5980-01-605-7342, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 3.2 MILLIMETERS NOMINAL MM |
| overall_height | 1.6 MILLIMETERS NOMINAL MM |
| special_features | OP TEMP: -30 DEG TO 85 DEG C; VARIUOS COLORS; DIFFUSED OPTICS; COMPATIBLE WITH IR SOLDER DEGC |
| lens_transparency | TRANSPARENT |
| end_item_identification | BACKLIGHTING APPLICATIONS AND FRONT PANEL ILLUMINATION |
| part_name_assigned_by_controlling_agency | SURFACE MOUNT CHIP LEDS |
| NSN | 5980-01-605-7342 |
| OVERALL HEIGHT | 1.6 MILLIMETERS NOMINAL MM |
| OVERALL WIDTH | 3.2 MILLIMETERS NOMINAL MM |
| LENS TRANSPARENCY | TRANSPARENT |
| SPECIAL FEATURES | OP TEMP: -30 DEG TO 85 DEG C; VARIUOS COLORS; DIFFUSED OPTICS; COMPATIBLE WITH IR SOLDER DEGC |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | SURFACE MOUNT CHIP LEDS |
| END ITEM IDENTIFICATION | BACKLIGHTING APPLICATIONS AND FRONT PANEL ILLUMINATION |
No substitute or cross-reference records for this part.