HROM9-0512-141 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HROM9-0512-141: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.280 INCHES MAXIMUM IN, body_height: 0.070 INCHES MAXIMUM IN, body_length: 0.405 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: W/ENABLE AND HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-360-6516, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HROM9-0512-141

NSN: 5962-00-360-6516
NIINs: 003606516, 003606517, 003606518, 003606519, 003606526
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.280 INCHES MAXIMUM IN
body_height	0.070 INCHES MAXIMUM IN
body_length	0.405 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	W/ENABLE AND HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
precious_material	GOLD
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	8 INPUT
NSN	5962-00-360-6516

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: GOLD

•

PRECIOUS MATERIAL: GOLD

•

BODY WIDTH: 0.280 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.070 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/BUFFERED OUTPUT AND W/ENABLE AND W/STORAGE

•

INCLOSURE CONFIGURATION: FLAT PACK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	GOLD
PRECIOUS MATERIAL	GOLD
BODY WIDTH	0.280 INCHES MAXIMUM IN
BODY HEIGHT	0.070 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/BUFFERED OUTPUT AND W/ENABLE AND W/STORAGE
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.405 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROM FAMILY 001Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is HROM9-0512-141?

HROM9-0512-141 is a MICROCIRCUIT,MEMORY.

What parts can replace HROM9-0512-141?

There is 1 known substitute for HROM9-0512-141: ROM/PROM FAMILY 001. Substitute compatibility should be verified for your specific system.

What is the NSN for HROM9-0512-141?

HROM9-0512-141 is cataloged in the U.S. Government catalog under NSN 5962-00-360-6516. This indicates validated use in U.S. government and defense supply chains.

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