HPROM1-1024-2G3567 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HPROM1-1024-2G3567: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-092-2733, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HPROM1-1024-2G3567

NSN: 5962-01-092-2733
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.200 INCHES MAXIMUM IN
body_length	0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/DISABLE AND HIGH SPEED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-092-2733

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.200 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/DISABLE AND HIGH SPEED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.200 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/DISABLE AND HIGH SPEED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 5

ROM/PROM FAMILY 005Reference document

Same NSN cross-reference

Reference document — Secondary reference

CW854FReference document

Same NSN cross-reference

Reference document — Secondary reference

DM7574ABA/J/883Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

HM1-7611-2-G3567Reference document

Same NSN cross-reference

Reference document — Secondary reference

HPR0M1-1024-2G35Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is HPROM1-1024-2G3567?

HPROM1-1024-2G3567 is a MICROCIRCUIT,MEMORY.

What parts can replace HPROM1-1024-2G3567?

There are 5 known substitutes for HPROM1-1024-2G3567: ROM/PROM FAMILY 005, CW854F, DM7574ABA/J/883 and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for HPROM1-1024-2G3567?

HPROM1-1024-2G3567 is cataloged in the U.S. Government catalog under NSN 5962-01-092-2733. This indicates validated use in U.S. government and defense supply chains.

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HPROM1-1024-2G3567 — MICROCIRCUIT,MEMORY

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