HMMP1836Y-168 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HMMP1836Y-168: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.150 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-248-3534, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HMMP1836Y-168

NSN: 5962-01-248-3534
FSC: 5962 — Microcircuits, Electronic
CAGE: 55267 — RAYTHEON COMPANY DBA RAYTHEON (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.150 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	15 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-248-3534

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.150 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	15 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.150 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROM FAMILY 020Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is HMMP1836Y-168?

HMMP1836Y-168 is a MICROCIRCUIT,MEMORY.

What parts can replace HMMP1836Y-168?

There is 1 known substitute for HMMP1836Y-168: ROM/PROM FAMILY 020. Substitute compatibility should be verified for your specific system.

What is the NSN for HMMP1836Y-168?

HMMP1836Y-168 is cataloged in the U.S. Government catalog under NSN 5962-01-248-3534. This indicates validated use in U.S. government and defense supply chains.

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