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HMMP1823CD — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

HMMP1823CD: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.520 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 1.220 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, special_features: ITEM MUST COMPLY WITH REQUIREMENTS OF DEFENSE SUPPLY CENTER COLUMBUS PRODUCTION STANDARD NO. LO3803, features_provided: HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL AND W/DECODED OUTPUT.

This part is cataloged in the U.S. Government catalog under NSN 5962-01-263-6060, indicating validated use in U.S. government and defense logistics supply chains.

Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
HMMP1823CD
NSN: 5962-01-263-6060
FSC: 5962 — Microcircuits, Electronic
CAGE: 82577 — RAYTHEON COMPANY DBA RAYTHEON (USA)
SPECIFICATIONS
body_width0.520 INCHES MAXIMUM IN
body_height0.180 INCHES MAXIMUM IN
body_length1.220 INCHES MAXIMUM IN
memory_capacityUNKNOWN
special_featuresITEM MUST COMPLY WITH REQUIREMENTS OF DEFENSE SUPPLY CENTER COLUMBUS PRODUCTION STANDARD NO. LO3803
features_providedHERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL AND W/DECODED OUTPUT
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-263-6060
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN HMMP1823CD MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 22 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.520 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.180 INCHES MAXIMUM IN
•
CRITICALITY CODE JUSTIFICATION: ZZZY
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL AND W/DECODED OUTPUT
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN22 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.520 INCHES MAXIMUM IN
BODY HEIGHT0.180 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATIONZZZY
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL AND W/DECODED OUTPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
BODY LENGTH1.220 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 3
LO3803Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
124326Reference document
Same NSN cross-reference
Reference document — Secondary reference
CDP1823CD/3Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is HMMP1823CD?
HMMP1823CD is a MICROCIRCUIT,MEMORY.
What parts can replace HMMP1823CD?
There are 3 known substitutes for HMMP1823CD: LO3803, 124326, CDP1823CD/3. Substitute compatibility should be verified for your specific system.
What is the NSN for HMMP1823CD?
HMMP1823CD is cataloged in the U.S. Government catalog under NSN 5962-01-263-6060. This indicates validated use in U.S. government and defense supply chains.
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