HMC463LP5: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 5.1 MILLIMETERS NOMINAL MM, body_height: 0.9 MILLIMETERS NOMINAL MM, operating_temp_range: -40.0 TO 85.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK, terminal_type_and_quantity: 24 BONDING PAD, current_rating_per_characteristic: 80.0 MILLIAMPERES MAXIMUM SUPPLY. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-718-3087, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 5.1 MILLIMETERS NOMINAL MM |
| body_height | 0.9 MILLIMETERS NOMINAL MM |
| operating_temp_range | -40.0 TO 85.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_type_and_quantity | 24 BONDING PAD |
| current_rating_per_characteristic | 80.0 MILLIAMPERES MAXIMUM SUPPLY |
| part_name_assigned_by_controlling_agency | LOW NOISE AMPLIFIER |
| NSN | 5962-01-718-3087 |
| BODY WIDTH | 5.1 MILLIMETERS NOMINAL MM |
| BODY HEIGHT | 0.9 MILLIMETERS NOMINAL MM |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 80.0 MILLIAMPERES MAXIMUM SUPPLY |
| OPERATING TEMP RANGE | -40.0 TO 85.0 CELSIUS DEGC |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | LOW NOISE AMPLIFIER |
| TERMINAL TYPE AND QUANTITY | 24 BONDING PAD |
No substitute or cross-reference records for this part.