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Technical Data Sheet
HM9-7603 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
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PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.248 INCHES MINIMUM AND 0.325 INCHES MAXIMUM IN, body_height: 0.110 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN, body_length: 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: PROGRAMMABLE AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-075-6867, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
HM9-7603
NSN: 5962-01-075-6867
FSC: 5962
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)
SPECIFICATIONS
body_width0.248 INCHES MINIMUM AND 0.325 INCHES MAXIMUM IN
body_height0.110 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN
body_length0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedPROGRAMMABLE AND ELECTROSTATIC SENSITIVE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
end_item_identificationB1B
NSN5962-01-075-6867
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN HM9-7603 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
INCLOSURE MATERIAL: CERAMIC AND GLASS
BODY LENGTH: 0.440 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPE: ROM
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 FLAT LEADS
MEMORY CAPACITY: UNKNOWN
INCLOSURE CONFIGURATION: FLAT PACK
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE MATERIALCERAMIC AND GLASS
BODY LENGTH0.440 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.5 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPEROM
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY16 FLAT LEADS
MEMORY CAPACITYUNKNOWN
INCLOSURE CONFIGURATIONFLAT PACK
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 29
X19988Interchangeable
interchangeable cross-reference
interchangeable
CC1648Interchangeable
interchangeable cross-reference
interchangeable
MM5331Interchangeable
interchangeable cross-reference
interchangeable
2144054-1Interchangeable
interchangeable cross-reference
interchangeable
17972Interchangeable
interchangeable cross-reference
interchangeable
751AInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is HM9-7603?
HM9-7603 is a MICROCIRCUIT,DIGITAL.
What parts can replace HM9-7603?
There are 29 known substitutes for HM9-7603: X19988, CC1648, MM5331 and 26 more. Substitute compatibility should be verified for your specific system.
What is the NSN for HM9-7603?
HM9-7603 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-075-6867. This indicates validated use in U.S. government and defense supply chains.
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