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HM9-7602-8 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

HM9-7602-8: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.325 INCHES MAXIMUM IN, body_height: 0.070 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BIPOLAR AND EXPANDABLE AND PROGRAMMABLE AND WIRE-OR OUTPUTS AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-006-7944, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
HM9-7602-8
NSN: 5962-01-006-7944
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)
SPECIFICATIONS
body_width0.325 INCHES MAXIMUM IN
body_height0.070 INCHES MAXIMUM IN
body_length0.440 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BIPOLAR AND EXPANDABLE AND PROGRAMMABLE AND WIRE-OR OUTPUTS AND W/ENABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-01-006-7944
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN HM9-7602-8 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 6 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.325 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.070 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BIPOLAR AND EXPANDABLE AND PROGRAMMABLE AND WIRE-OR OUTPUTS AND W/ENABLE
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN6 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.325 INCHES MAXIMUM IN
BODY HEIGHT0.070 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BIPOLAR AND EXPANDABLE AND PROGRAMMABLE AND WIRE-OR OUTPUTS AND W/ENABLE
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEROM
BODY LENGTH0.440 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 6
HPROM9-8256-8Reference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROM HEAD 004Reference document
Same NSN cross-reference
Reference document — Secondary reference
S82S23W/883CReference document
Same NSN cross-reference
Reference document — Secondary reference
HPROM9-8256-2Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
MM5330-1F/883Reference document
Same NSN cross-reference
Reference document — Secondary reference
HM9-8256-8Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is HM9-7602-8?
HM9-7602-8 is a MICROCIRCUIT,MEMORY.
What parts can replace HM9-7602-8?
There are 6 known substitutes for HM9-7602-8: HPROM9-8256-8, ROM/PROM HEAD 004, S82S23W/883C and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for HM9-7602-8?
HM9-7602-8 is cataloged in the U.S. Government catalog under NSN 5962-01-006-7944. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.