HM9-0168-8 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HM9-0168-8: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.260 INCHES NOMINAL IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.260 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND DIELECTRIC ISOLATED, output_logic_form: DIODE LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-196-1449, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HM9-0168-8

NSN: 5962-01-196-1449
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.260 INCHES NOMINAL IN
body_height	0.085 INCHES MAXIMUM IN
body_length	0.260 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND DIELECTRIC ISOLATED
output_logic_form	DIODE LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-196-1449

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.260 INCHES NOMINAL IN

•

BODY HEIGHT: 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND DIELECTRIC ISOLATED

•

INCLOSURE CONFIGURATION: FLAT PACK

•

BODY LENGTH: 0.260 INCHES NOMINAL IN

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.260 INCHES NOMINAL IN
BODY HEIGHT	0.085 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND DIELECTRIC ISOLATED
INCLOSURE CONFIGURATION	FLAT PACK
BODY LENGTH	0.260 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	DIODE LOGIC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROM HEAD 057Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is HM9-0168-8?

HM9-0168-8 is a MICROCIRCUIT,DIGITAL.

What parts can replace HM9-0168-8?

There is 1 known substitute for HM9-0168-8: ROM/PROM HEAD 057. Substitute compatibility should be verified for your specific system.

What is the NSN for HM9-0168-8?

HM9-0168-8 is cataloged in the U.S. Government catalog under NSN 5962-01-196-1449. This indicates validated use in U.S. government and defense supply chains.

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