HM6116-4: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 14.66 MILLIMETERS NOMINAL MM, body_height: 5.51 MILLIMETERS MAXIMUM MM, body_length: 31.75 MILLIMETERS NOMINAL MM, features_provided: HERMETICALLY SEALED AND HIGH SPEED AND LOW POWER AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-192-0210, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 14.66 MILLIMETERS NOMINAL MM |
| body_height | 5.51 MILLIMETERS MAXIMUM MM |
| body_length | 31.75 MILLIMETERS NOMINAL MM |
| features_provided | HERMETICALLY SEALED AND HIGH SPEED AND LOW POWER AND W/ENABLE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 22 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-192-0210 |
| INPUT CIRCUIT PATTERN | 22 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 14.66 MILLIMETERS NOMINAL MM |
| BODY HEIGHT | 5.51 MILLIMETERS MAXIMUM MM |
| FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH SPEED AND LOW POWER AND W/ENABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 31.75 MILLIMETERS NOMINAL MM |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |