HM4-65162-8 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HM4-65162-8: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.450 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN, body_length: 0.450 INCHES MAXIMUM IN, special_features: MADE FROM 8403602XX, features_provided: HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-228-2982, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HM4-65162-8

NSN: 5962-01-228-2982
NIINs: 012282982, 012390420
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.450 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN
body_length	0.450 INCHES MAXIMUM IN
special_features	MADE FROM 8403602XX
features_provided	HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-54.0 TO 85.0 CELSIUS DEGC
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-228-2982

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.450 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 0.450 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.450 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.450 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

SUBSTITUTES & CROSS-REFERENCES 1

A3012572-4Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is HM4-65162-8?

HM4-65162-8 is a MICROCIRCUIT,MEMORY.

What parts can replace HM4-65162-8?

There is 1 known substitute for HM4-65162-8: A3012572-4. Substitute compatibility should be verified for your specific system.

What is the NSN for HM4-65162-8?

HM4-65162-8 is cataloged in the U.S. Government catalog under NSN 5962-01-228-2982. This indicates validated use in U.S. government and defense supply chains.

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HM4-65162-8 — MICROCIRCUIT,MEMORY

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