HM1-0186-2: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.248 INCHES NOMINAL IN, body_height: 0.120 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN, body_length: 0.765 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND DIELECTRIC ISOLATED AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.
Government catalog under NSN 5962-00-481-8640, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.248 INCHES NOMINAL IN |
| body_height | 0.120 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN |
| body_length | 0.765 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED AND DIELECTRIC ISOLATED AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 8 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| maximum_power_dissipation_rating | 450.0 MILLIWATTS |
| NSN | 5962-00-481-8640 |
| INPUT CIRCUIT PATTERN | 8 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.100 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 0.685 INCHES MINIMUM AND 0.715 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -40.0 TO 85.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -40.0 TO 71.0 CELSIUS DEGC |