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HLMP2685 — SEMICONDUCTOR DEVICE ASSEMBLY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

HLMP2685: SEMICONDUCTOR DEVICE ASSEMBLY.

The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 10.3 MILLIMETERS NOMINAL MM, overall_height: 19.1 MILLIMETERS NOMINAL MM, overall_length: 8.9 MILLIMETERS NOMINAL MM, major_components: 1 8-PIN DIP; 1 LED CHIP, special_features: LIGHT EMITTING AREA 0.350 IN. BY 0.750 IN.

IN, end_item_identification: LAUNCHER, GUIDED MISSLE, CARRIER MOUNTED. This part is cataloged in the U.S. Government catalog under NSN 5980-01-269-9668, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
HLMP2685
NSN: 5980-01-269-9668
NIINs: 012699668, 017160329
FSC: 5980 — Optoelectronic Devices and Associated Hardware
CAGE: 50434 — AVAGO TECHNOLOGIES US INC DIV AVAGO TECHNOLOGIES (USA)
SPECIFICATIONS
overall_width10.3 MILLIMETERS NOMINAL MM
overall_height19.1 MILLIMETERS NOMINAL MM
overall_length8.9 MILLIMETERS NOMINAL MM
major_components1 8-PIN DIP; 1 LED CHIP
special_featuresLIGHT EMITTING AREA 0.350 IN. BY 0.750 IN. IN
end_item_identificationLAUNCHER, GUIDED MISSLE, CARRIER MOUNTED
part_name_assigned_by_controlling_agencyLED LIGHT BARS
NSN5980-01-269-9668
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available SEMICONDUCTOR DEVICE ASSEMBLY TITLE COMPONENT PN HLMP2685 MFR SEMICONDUCTOR DEVICE A
KEY FEATURES
•
MAJOR COMPONENTS: 1 8-PIN DIP; 1 LED CHIP
TECHNICAL CHARACTERISTICS
MAJOR COMPONENTS1 8-PIN DIP; 1 LED CHIP
SPECIAL FEATURESLIGHT EMITTING AREA 0.350 IN. BY 0.750 IN. IN
SUBSTITUTES & CROSS-REFERENCES 2
SMS 5039Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
0213071F00Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is HLMP2685?
HLMP2685 is a SEMICONDUCTOR DEVICE ASSEMBLY.
What parts can replace HLMP2685?
There are 2 known substitutes for HLMP2685: SMS 5039, 0213071F00. Substitute compatibility should be verified for your specific system.
What is the NSN for HLMP2685?
HLMP2685 is cataloged in the U.S. Government catalog under NSN 5980-01-269-9668. This indicates validated use in U.S. government and defense supply chains.
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