HLMP-2550: LIGHT EMITTING DIODE.
The LIGHT EMITTING DIODE is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 0.195 INCHES MAXIMUM IN, overall_height: 0.245 INCHES NOMINAL IN, overall_length: 0.800 INCHES MAXIMUM IN, mounting_method: PRESS FIT, lens_transparency: TRANSPARENT. This part is cataloged in the U.S.
Government catalog under NSN 5980-01-166-7514, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| overall_width | 0.195 INCHES MAXIMUM IN |
| overall_height | 0.245 INCHES NOMINAL IN |
| overall_length | 0.800 INCHES MAXIMUM IN |
| mounting_method | PRESS FIT |
| lens_transparency | TRANSPARENT |
| luminous_intensity | 1.5 MILLICANDELA MINIMUM |
| internal_configuration | POINT CONTACT |
| semiconductor_material | SILICON |
| terminal_type_and_quantity | 8 PIN AND 1 CASE |
| color_tone_produced_per_source | GREEN LENS |
| internal_junction_configuration | PN |
| NSN | 5980-01-166-7514 |
| OVERALL HEIGHT | 0.245 INCHES NOMINAL IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 6.0 MAXIMUM REVERSE VOLTAGE, DC |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 85.0 CELSIUS AMBIENT AIR DEGC |
| MOUNTING METHOD | PRESS FIT |
| INTERNAL JUNCTION CONFIGURATION | PN |
| SEMICONDUCTOR MATERIAL | SILICON |
| LUMINOUS INTENSITY | 1.5 MILLICANDELA MINIMUM |
| OVERALL LENGTH | 0.800 INCHES MAXIMUM IN |
| INTERNAL CONFIGURATION | POINT CONTACT |
| OVERALL WIDTH | 0.195 INCHES MAXIMUM IN |