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HL41124 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

HL41124: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.283 INCHES MAXIMUM IN, body_height: 0.090 INCHES MAXIMUM IN, body_length: 0.409 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STORAGE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-012-6506, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
HL41124
NSN: 5962-01-012-6506
FSC: 5962 — Microcircuits, Electronic
CAGE: 07263 — FAIRCHILD SEMICONDUCTOR CORP (USA)
SPECIFICATIONS
body_width0.283 INCHES MAXIMUM IN
body_height0.090 INCHES MAXIMUM IN
body_length0.409 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STORAGE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern13 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-01-012-6506
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN HL41124 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 13 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.283 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.090 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STORAGE
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: RAM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN13 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.283 INCHES MAXIMUM IN
BODY HEIGHT0.090 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STORAGE
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPERAM
BODY LENGTH0.409 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 3
CV583Reference document
Same NSN cross-reference
Reference document — Secondary reference
S82S10WJReference document
Same NSN cross-reference
Reference document — Secondary reference
SCM27156F3Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is HL41124?
HL41124 is a MICROCIRCUIT,MEMORY.
What parts can replace HL41124?
There are 3 known substitutes for HL41124: CV583, S82S10WJ, SCM27156F3. Substitute compatibility should be verified for your specific system.
What is the NSN for HL41124?
HL41124 is cataloged in the U.S. Government catalog under NSN 5962-01-012-6506. This indicates validated use in U.S. government and defense supply chains.
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