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Technical Data Sheet
HL22763 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.665 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND LOW POWER AND HIGH GAIN AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS, inclosure_material: CERAMIC AND GLASS, memory_device_type: ROM. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-584-1646, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
HL22763
NSN: 5962-00-584-1646
FSC: 5962
CAGE: 07263 — FAIRCHILD SEMICONDUCTOR CORP (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length0.665 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
features_providedMONOLITHIC AND HERMETICALLY SEALED AND LOW POWER AND HIGH GAIN AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_patternDUAL 2 INPUT
end_item_identificationTYPE AN/TCC-78 MULTIPLEXER SET
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-00-584-1646
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN HL22763 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
INCLOSURE MATERIAL: CERAMIC AND GLASS
BODY LENGTH: 0.665 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN: DUAL 2 INPUT
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND LOW POWER AND HIGH GAIN AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS
MEMORY DEVICE TYPE: ROM
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE MATERIALCERAMIC AND GLASS
BODY LENGTH0.665 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
END ITEM IDENTIFICATIONTYPE AN/TCC-78 MULTIPLEXER SET
INPUT CIRCUIT PATTERNDUAL 2 INPUT
FEATURES PROVIDEDMONOLITHIC AND HERMETICALLY SEALED AND LOW POWER AND HIGH GAIN AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS
MEMORY DEVICE TYPEROM
BODY HEIGHT0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATORT0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
TEST DATA DOCUMENT80063-SM-A-732441 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
VERIFIED SUBSTITUTES & CROSS-REFERENCES 3
747DCInterchangeable
interchangeable cross-reference
interchangeable
U7A7747393Interchangeable
interchangeable cross-reference
interchangeable
UA747CInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is HL22763?
HL22763 is a MICROCIRCUIT,MEMORY.
What parts can replace HL22763?
There are 3 known substitutes for HL22763: 747DC, U7A7747393, UA747C. Substitute compatibility should be verified for your specific system.
What is the NSN for HL22763?
HL22763 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-584-1646. This indicates validated use in U.S. government and defense supply chains.
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