HI4-506-883 — MICROCIRCUIT,LINEAR

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HI4-506-883: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.400 INCHES NOMINAL IN, body_height: 0.045 INCHES NOMINAL IN, body_length: 0.400 INCHES NOMINAL IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/ENABLE, inclosure_material: CERAMIC OR METAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-273-4245, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HI4-506-883

NSN: 5962-01-273-4245
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.400 INCHES NOMINAL IN
body_height	0.045 INCHES NOMINAL IN
body_length	0.400 INCHES NOMINAL IN
features_provided	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/ENABLE
inclosure_material	CERAMIC OR METAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	5 INPUT AND 16 CHANNEL
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	28 LEADLESS
NSN	5962-01-273-4245

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 5 INPUT AND 16 CHANNEL

•

INCLOSURE MATERIAL: CERAMIC OR METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 MULTIPLEXER, ANALOG

•

BODY WIDTH: 0.400 INCHES NOMINAL IN

•

BODY HEIGHT: 0.045 INCHES NOMINAL IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/ENABLE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	5 INPUT AND 16 CHANNEL
INCLOSURE MATERIAL	CERAMIC OR METAL
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 MULTIPLEXER, ANALOG
BODY WIDTH	0.400 INCHES NOMINAL IN
BODY HEIGHT	0.045 INCHES NOMINAL IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/ENABLE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
BODY LENGTH	0.400 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

5188910-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

G282794-853Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

5962-85131Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-85131073ASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is HI4-506-883?

HI4-506-883 is a MICROCIRCUIT,LINEAR.

What parts can replace HI4-506-883?

There are 4 known substitutes for HI4-506-883: 5188910-001, G282794-853, 5962-85131 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for HI4-506-883?

HI4-506-883 is cataloged in the U.S. Government catalog under NSN 5962-01-273-4245. This indicates validated use in U.S. government and defense supply chains.

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