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Technical Data Sheet

HI1-546/883 — MICROCIRCUIT,LINEAR

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

HI1-546/883: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.520 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 1.480 INCHES MAXIMUM IN, special_features: NUCLEAR HARDNESS CRITICAL ITEMS, features_provided: HERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC AND ELECTROSTATIC SENSITIVE, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-238-6827, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
HI1-546/883
NSN: 5962-01-238-6827
NIINs: 012386827, 013299229, 014839605
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)
SPECIFICATIONS
body_width0.520 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.140 INCHES MAXIMUM IN
body_length1.480 INCHES MAXIMUM IN
special_featuresNUCLEAR HARDNESS CRITICAL ITEMS
features_providedHERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC AND ELECTROSTATIC SENSITIVE
inclosure_materialCERAMIC AND GLASS
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 CHANNEL AND 20 INPUT
end_item_identification1920-01-243-7286/LEVER, BAR - TANK, ABRAMS M-1
inclosure_configurationDUAL-IN-LINE
NSN5962-01-238-6827
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,LINEAR TITLE COMPONENT PN HI1-546/883 MFR MICROCIRCUIT,LINEAR
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 16 CHANNEL AND 20 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: TIN
•
DESIGN FUNCTION AND QUANTITY: 1 MULTIPLEXER/DEMULTIPLEXER, CMOS
•
BODY WIDTH: 0.520 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.140 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN16 CHANNEL AND 20 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTTIN
DESIGN FUNCTION AND QUANTITY1 MULTIPLEXER/DEMULTIPLEXER, CMOS
BODY WIDTH0.520 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT0.140 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
BODY LENGTH1.480 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 9
143503618-001Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
HI1-546-5Reference document
Same NSN cross-reference
Reference document — Replaced / superseded reference
HI1-0506A-8Reference document
Same NSN cross-reference
Reference document — Secondary reference
DG506ACK-4Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
5962-85131Reference document
Same NSN cross-reference
Reference document — Identification reference
2907408-1Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusCancelled· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is HI1-546/883?
HI1-546/883 is a MICROCIRCUIT,LINEAR.
What parts can replace HI1-546/883?
There are 9 known substitutes for HI1-546/883: 143503618-001, HI1-546-5, HI1-0506A-8 and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for HI1-546/883?
HI1-546/883 is cataloged in the U.S. Government catalog under NSN 5962-01-238-6827. This indicates validated use in U.S. government and defense supply chains.
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