HI1-508-8 — MICROCIRCUIT,LINEAR

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HI1-508-8: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, special_features: ELECTROSTATIC DISCHARGE SENSITIVE, features_provided: ELECTROSTATIC SENSITIVE AND MONOLITHIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-030-4416, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HI1-508-8

NSN: 5962-01-030-4416
NIINs: 010304416, 012780773
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	0.840 INCHES MAXIMUM IN
special_features	ELECTROSTATIC DISCHARGE SENSITIVE
features_provided	ELECTROSTATIC SENSITIVE AND MONOLITHIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	8 CHANNEL
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-030-4416

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 4 INPUT AND 8 CHANNEL

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 MULTIPLEXER, ANALOG

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND LOW POWER AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	4 INPUT AND 8 CHANNEL
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 MULTIPLEXER, ANALOG
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND LOW POWER AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
BODY LENGTH	0.840 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

HI1-0508/883Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

755090A0058-1Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

DG508AK/883Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is HI1-508-8?

HI1-508-8 is a MICROCIRCUIT,LINEAR.

What parts can replace HI1-508-8?

There are 3 known substitutes for HI1-508-8: HI1-0508/883, 755090A0058-1, DG508AK/883. Substitute compatibility should be verified for your specific system.

What is the NSN for HI1-508-8?

HI1-508-8 is cataloged in the U.S. Government catalog under NSN 5962-01-030-4416. This indicates validated use in U.S. government and defense supply chains.

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HI1-508-8 — MICROCIRCUIT,LINEAR

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