HEF4526BP — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HEF4526BP: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.870 INCHES MAXIMUM IN, features_provided: LOW POWER AND W/CLOCK AND W/INHIBIT AND W/PRESET, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-013-8770, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HEF4526BP

NSN: 5962-01-013-8770
FSC: 5962 — Microcircuits, Electronic
CAGE: F6650 — PHILIPS COMPOSANTS SA DIVISION SEMICONDUCTEURS (FRA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	0.870 INCHES MAXIMUM IN
bit_quantity	4
features_provided	LOW POWER AND W/CLOCK AND W/INHIBIT AND W/PRESET
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-40.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	9 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-013-8770

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 4

•

INPUT CIRCUIT PATTERN: 9 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: LOW POWER AND W/CLOCK AND W/INHIBIT AND W/PRESET

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	4
INPUT CIRCUIT PATTERN	9 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	LOW POWER AND W/CLOCK AND W/INHIBIT AND W/PRESET
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.870 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 5

MC14526BCPReference document

Same NSN cross-reference

Reference document — Design control — primary reference

ICE007144Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

264045260Reference document

Same NSN cross-reference

Reference document — Secondary reference

MC14526CPReference document

Same NSN cross-reference

Reference document — Secondary reference

A4355Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is HEF4526BP?

HEF4526BP is a MICROCIRCUIT,MEMORY.

What parts can replace HEF4526BP?

There are 5 known substitutes for HEF4526BP: MC14526BCP, ICE007144, 264045260 and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for HEF4526BP?

HEF4526BP is cataloged in the U.S. Government catalog under NSN 5962-01-013-8770. This indicates validated use in U.S. government and defense supply chains.

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