HD63B03YP — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HD63B03YP: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.717 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 2.268 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND ELECTROSTATIC SENSITIVE AND W/CLOCK AND BIDIRECTIONAL, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-377-9349, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HD63B03YP

NSN: 5962-01-377-9349
FSC: 5962 — Microcircuits, Electronic
CAGE: 62786 — HITACHI AMERICA LTD DBA HITACHI COMPUTER PRODUCTS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.717 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	2.268 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND ELECTROSTATIC SENSITIVE AND W/CLOCK AND BIDIRECTIONAL
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-55.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-20.0 TO 70.0 CELSIUS DEGC
body_outside_diameter	0.180 INCHES MAXIMUM IN
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
design_function_and_quantity	1 MICROPROCESSOR
NSN	5962-01-377-9349

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY OUTSIDE DIAMETER: 0.180 INCHES MAXIMUM IN

•

DESIGN FUNCTION AND QUANTITY: 1 MICROPROCESSOR

•

BODY WIDTH: 0.717 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

CAPITANCE RATING PER CHARACTERISTIC: 12.50 INPUT PICOFARADS MAXIMUM

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND ELECTROSTATIC SENSITIVE AND W/CLOCK AND BIDIRECTIONAL

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY OUTSIDE DIAMETER	0.180 INCHES MAXIMUM IN
DESIGN FUNCTION AND QUANTITY	1 MICROPROCESSOR
BODY WIDTH	0.717 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
CAPITANCE RATING PER CHARACTERISTIC	12.50 INPUT PICOFARADS MAXIMUM
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND ELECTROSTATIC SENSITIVE AND W/CLOCK AND BIDIRECTIONAL
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	30.00 MILLIAMPERES MAXIMUM SUPPLY

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is HD63B03YP?

HD63B03YP is a MICROCIRCUIT,DIGITAL.

What is the NSN for HD63B03YP?

HD63B03YP is cataloged in the U.S. Government catalog under NSN 5962-01-377-9349. This indicates validated use in U.S. government and defense supply chains.

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HD63B03YP — MICROCIRCUIT,DIGITAL

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