The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.280 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-OXIDIZED-SILICON LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-101-5649, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.280 INCHES MAXIMUM IN |
| body_height | 0.200 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| output_logic_form | COMPLEMENTARY-OXIDIZED-SILICON LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 2 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| design_function_and_quantity | 4 GATE, NAND |
| maximum_power_dissipation_rating | 500.0 MILLIWATTS |
| NSN | 5962-01-101-5649 |
| INPUT CIRCUIT PATTERN | 2 INPUT |
| OUTPUT LOGIC FORM | COMPLEMENTARY-OXIDIZED-SILICON LOGIC |
| DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
| BODY HEIGHT | 0.200 INCHES MAXIMUM IN |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| INCLOSURE MATERIAL | CERAMIC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 0.785 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |