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HCPA60FR — SEMICONDUCTOR DEVICE ASSEMBLY

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

HCPA60FR: SEMICONDUCTOR DEVICE ASSEMBLY.

The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 0.390 INCHES NOMINAL IN, overall_height: 2.250 INCHES NOMINAL IN, overall_length: 1.00 INCHES NOMINAL IN, special_features: OPERATING TEMPERATURE: -55.00 DEG. C.

TO 150.00 DEG. C.; CURRENT RATING: 36.00 AMPS; VOLTAGE RATING: 600.00 VDC MAX; VDC, end_item_identification: ANSQQ-89, part_name_assigned_by_controlling_agency: CENTER TAP DOUBLER ASSEMBLY. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-625-8474, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
HCPA60FR
NSN: 5961-01-625-8474
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 13409 — RSM ELECTRON POWER INC (USA)
SPECIFICATIONS
overall_width0.390 INCHES NOMINAL IN
overall_height2.250 INCHES NOMINAL IN
overall_length1.00 INCHES NOMINAL IN
special_featuresOPERATING TEMPERATURE: -55.00 DEG. C. TO 150.00 DEG. C.; CURRENT RATING: 36.00 AMPS; VOLTAGE RATING: 600.00 VDC MAX; VDC
end_item_identificationANSQQ-89
part_name_assigned_by_controlling_agencyCENTER TAP DOUBLER ASSEMBLY
NSN5961-01-625-8474
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN HCPA60FR MFR OEM SEMICONDUCTOR DEVICE ASSEMBLY
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT2.250 INCHES NOMINAL IN
OVERALL LENGTH1.00 INCHES NOMINAL IN
OVERALL WIDTH0.390 INCHES NOMINAL IN
SPECIAL FEATURESOPERATING TEMPERATURE: -55.00 DEG. C. TO 150.00 DEG. C.; CURRENT RATING: 36.00 AMPS; VOLTAGE RATING: 600.00 VDC MAX; VDC
PART NAME ASSIGNED BY CONTROLLING AGENCYCENTER TAP DOUBLER ASSEMBLY
END ITEM IDENTIFICATIONANSQQ-89
OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is HCPA60FR?
HCPA60FR is a SEMICONDUCTOR DEVICE ASSEMBLY.
What is the NSN for HCPA60FR?
HCPA60FR is cataloged in the U.S. Government catalog under NSN 5961-01-625-8474. This indicates validated use in U.S. government and defense supply chains.
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