HA4-5147/883: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.358 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.358 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED, inclosure_material: CERAMIC, storage_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-392-9185, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.358 INCHES MAXIMUM IN |
| body_height | 0.100 INCHES MAXIMUM IN |
| body_length | 0.358 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED |
| inclosure_material | CERAMIC |
| storage_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 20 LEADLESS |
| design_function_and_quantity | 1 AMPLIFIER, OPERATIONAL, LINEAR |
| time_rating_per_chacteristic | 100.00 NANOSECONDS MAXIMUM FALL NS |
| NSN | 5962-01-392-9185 |
| INCLOSURE MATERIAL | PLASTIC |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| FEATURES PROVIDED | HERMETICALLY SEALED |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| TERMINAL TYPE AND QUANTITY | 20 LEADLESS |