H6264LP-10 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

H6264LP-10: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 13.4 MILLIMETERS NOMINAL MM, body_height: 5.29 MILLIMETERS MAXIMUM MM, body_length: 36.0 MILLIMETERS NOMINAL MM, features_provided: W/ENABLE AND BIDIRECTIONAL AND STATIC OPERATION AND 3-STATE OUTPUT, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-263-7001, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

H6264LP-10

NSN: 5962-01-263-7001
FSC: 5962 — Microcircuits, Electronic
CAGE: 62786 — HITACHI AMERICA LTD DBA HITACHI COMPUTER PRODUCTS AMERICA INC (USA)

SPECIFICATIONS

body_width	13.4 MILLIMETERS NOMINAL MM
body_height	5.29 MILLIMETERS MAXIMUM MM
body_length	36.0 MILLIMETERS NOMINAL MM
features_provided	W/ENABLE AND BIDIRECTIONAL AND STATIC OPERATION AND 3-STATE OUTPUT
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	25 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-263-7001

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 25 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 13.4 MILLIMETERS NOMINAL MM

•

BODY HEIGHT: 5.29 MILLIMETERS MAXIMUM MM

•

FEATURES PROVIDED: W/ENABLE AND BIDIRECTIONAL AND STATIC OPERATION AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	25 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	13.4 MILLIMETERS NOMINAL MM
BODY HEIGHT	5.29 MILLIMETERS MAXIMUM MM
FEATURES PROVIDED	W/ENABLE AND BIDIRECTIONAL AND STATIC OPERATION AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	36.0 MILLIMETERS NOMINAL MM
STORAGE TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is H6264LP-10?

H6264LP-10 is a MICROCIRCUIT,MEMORY.

What parts can replace H6264LP-10?

There is 1 known substitute for H6264LP-10: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for H6264LP-10?

H6264LP-10 is cataloged in the U.S. Government catalog under NSN 5962-01-263-7001. This indicates validated use in U.S. government and defense supply chains.

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