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H5530204 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

H5530204: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.252 INCHES MAXIMUM IN, body_height: 0.115 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN, body_length: 0.745 INCHES MINIMUM AND 0.755 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-086-9230, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
H5530204
NSN: 5962-01-086-9230
FSC: 5962 — Microcircuits, Electronic
CAGE: 13799 — H & E VENTURE, LLC (USA)
SPECIFICATIONS
body_width0.245 INCHES MINIMUM AND 0.252 INCHES MAXIMUM IN
body_height0.115 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN
body_length0.745 INCHES MINIMUM AND 0.755 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern9 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-086-9230
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN H5530204 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 9 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.245 INCHES MINIMUM AND 0.252 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.115 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN9 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.245 INCHES MINIMUM AND 0.252 INCHES MAXIMUM IN
BODY HEIGHT0.115 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH0.745 INCHES MINIMUM AND 0.755 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 4
D3621Reference document
Same NSN cross-reference
Reference document — Secondary reference
82S129Reference document
Same NSN cross-reference
Reference document — Secondary reference
1DTDS1212-1Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
ROM/PROM FAMILY 005Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation
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FREQUENTLY ASKED QUESTIONS
What is H5530204?
H5530204 is a MICROCIRCUIT,MEMORY.
What parts can replace H5530204?
There are 4 known substitutes for H5530204: D3621, 82S129, 1DTDS1212-1 and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for H5530204?
H5530204 is cataloged in the U.S. Government catalog under NSN 5962-01-086-9230. This indicates validated use in U.S. government and defense supply chains.
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