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Technical Data Sheet
PartsTable / COMPONENT / GR1-2B1
GR1-2B1 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE, output_logic_form: DIODE-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-161-2879, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
GR1-2B1
NSN: 5962-00-161-2879
FSC: 5962
CAGE: 99696 — LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN SYSTEMS & GLOBAL SOLUTIONS (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
body_height0.180 INCHES MAXIMUM IN
body_length0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS AND EXPANDABLE
output_logic_formDIODE-TRANSISTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_patternDUAL 4 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-00-161-2879
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN GR1-2B1 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
MAXIMUM POWER DISSIPATION RATING: 85.0 MILLIWATTS
•
DESIGN FUNCTION AND QUANTITY: 2 BUFFER
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 8.0 VOLTS MAXIMUM POWER SOURCE
•
INCLOSURE MATERIAL: CERAMIC
•
INPUT CIRCUIT PATTERN: DUAL 4 INPUT
•
BODY HEIGHT: 0.180 INCHES MAXIMUM IN
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
BODY LENGTH: 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
TECHNICAL CHARACTERISTICS (FLIS)
MAXIMUM POWER DISSIPATION RATING85.0 MILLIWATTS
DESIGN FUNCTION AND QUANTITY2 BUFFER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC8.0 VOLTS MAXIMUM POWER SOURCE
INCLOSURE MATERIALCERAMIC
INPUT CIRCUIT PATTERNDUAL 4 INPUT
BODY HEIGHT0.180 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BODY LENGTH0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY WIDTH0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
U6A993251XInterchangeable
interchangeable cross-reference
interchangeable
338950-2Interchangeable
interchangeable cross-reference
interchangeable
NC3485Interchangeable
interchangeable cross-reference
interchangeable
3520023-001Interchangeable
interchangeable cross-reference
interchangeable
MC932LInterchangeable
interchangeable cross-reference
interchangeable
94333Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is GR1-2B1?
GR1-2B1 is a MICROCIRCUIT,DIGITAL.
What parts can replace GR1-2B1?
There are 16 known substitutes for GR1-2B1: U6A993251X, 338950-2, NC3485 and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for GR1-2B1?
GR1-2B1 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-161-2879. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026