GPD-602: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_height: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, features_provided: HYBRID AND THIN FILM, inclosure_material: METAL, storage_temp_range: -65.0 TO 200.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, body_outside_diameter: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-122-0718, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_height | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| features_provided | HYBRID AND THIN FILM |
| inclosure_material | METAL |
| storage_temp_range | -65.0 TO 200.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| input_circuit_pattern | 1 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 4 PIN |
| design_function_and_quantity | 1 AMPLIFIER, HYBRID |
| case_outline_source_and_designator | T0-5 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| NSN | 5962-01-122-0718 |
| INPUT CIRCUIT PATTERN | 1 INPUT |
| INCLOSURE MATERIAL | METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, HYBRID |
| BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HYBRID AND THIN FILM |
| INCLOSURE CONFIGURATION | CAN |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-5 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| STORAGE TEMP RANGE | -65.0 TO 200.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.