GM820BKC1: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.532 INCHES MAXIMUM IN, body_height: 0.162 INCHES MAXIMUM IN, body_length: 1.250 INCHES NOMINAL IN, overall_height: 0.325 INCHES NOMINAL IN, overall_length: 1.250 INCHES NOMINAL IN, memory_capacity: UNKNOWN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-339-4900, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.532 INCHES MAXIMUM IN |
| body_height | 0.162 INCHES MAXIMUM IN |
| body_length | 1.250 INCHES NOMINAL IN |
| overall_height | 0.325 INCHES NOMINAL IN |
| overall_length | 1.250 INCHES NOMINAL IN |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND W/ENABLE AND BIDIRECTIONAL AND POSITIVE OUTPUTS |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | EEPROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-339-4900 |
| OVERALL HEIGHT | 0.325 INCHES NOMINAL IN |
| INPUT CIRCUIT PATTERN | 22 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.532 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.162 INCHES MAXIMUM IN |
| CAPITANCE RATING PER CHARACTERISTIC | 10.00 INPUT PICOFARADS MAXIMUM AND 10.00 OUTPUT PICOFARADS MAXIMUM |
| OVERALL LENGTH | 1.250 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND W/ENABLE AND BIDIRECTIONAL AND POSITIVE OUTPUTS |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |