GM820ARV1ACN — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

GM820ARV1ACN: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.560 INCHES MAXIMUM IN, body_height: 0.105 INCHES NOMINAL IN, body_length: 1.215 INCHES MAXIMUM IN, bit_quantity: 8192, word_quantity: 1024, features_provided: 3-STATE OUTPUT AND LOW POWER AND STATIC OPERATION. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-140-8070, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

GM820ARV1ACN

NSN: 5962-01-140-8070
FSC: 5962 — Microcircuits, Electronic
CAGE: 26512 — NORTHROP GRUMMAN SYSTEMS CORPORATION (USA)

SPECIFICATIONS

body_width	0.560 INCHES MAXIMUM IN
body_height	0.105 INCHES NOMINAL IN
body_length	1.215 INCHES MAXIMUM IN
bit_quantity	8192
word_quantity	1024
features_provided	3-STATE OUTPUT AND LOW POWER AND STATIC OPERATION
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-140-8070

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 8192

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

WORD QUANTITY: 1024

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.560 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.105 INCHES NOMINAL IN

•

FEATURES PROVIDED: 3-STATE OUTPUT AND LOW POWER AND STATIC OPERATION

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	8192
INPUT CIRCUIT PATTERN	12 INPUT
WORD QUANTITY	1024
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.560 INCHES MAXIMUM IN
BODY HEIGHT	0.105 INCHES NOMINAL IN
FEATURES PROVIDED	3-STATE OUTPUT AND LOW POWER AND STATIC OPERATION
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

MCM68A708CReference document

Same NSN cross-reference

Reference document — Design control — primary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is GM820ARV1ACN?

GM820ARV1ACN is a MICROCIRCUIT,MEMORY.

What parts can replace GM820ARV1ACN?

There is 1 known substitute for GM820ARV1ACN: MCM68A708C. Substitute compatibility should be verified for your specific system.

What is the NSN for GM820ARV1ACN?

GM820ARV1ACN is cataloged in the U.S. Government catalog under NSN 5962-01-140-8070. This indicates validated use in U.S. government and defense supply chains.

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GM820ARV1ACN — MICROCIRCUIT,MEMORY

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