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GEM12112Q2A — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

GEM12112Q2A: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include memory_capacity: UNKNOWN, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, memory_device_type: FIRST-IN FIRST-OUT, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK, terminal_type_and_quantity: 20 BONDING PAD. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-591-1091, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
GEM12112Q2A
NSN: 5962-01-591-1091
FSC: 5962 — Microcircuits, Electronic
CAGE: 0DKS7 — SRI INTERNATIONAL (USA)
SPECIFICATIONS
memory_capacityUNKNOWN
output_logic_formBIPOLAR METAL-OXIDE SEMICONDUCTOR
memory_device_typeFIRST-IN FIRST-OUT
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationLEADLESS FLAT PACK
terminal_type_and_quantity20 BONDING PAD
case_outline_source_and_designatorCQCC1-N20 MIL-M-38510
voltage_rating_and_type_per_characteristic7.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-591-1091
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN GEM12112Q2A MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: FIRST-IN FIRST-OUT
•
CASE OUTLINE SOURCE AND DESIGNATOR: CQCC1-N20 MIL-M-38510
•
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 20 BONDING PAD
•
MEMORY CAPACITY: UNKNOWN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPEFIRST-IN FIRST-OUT
CASE OUTLINE SOURCE AND DESIGNATORCQCC1-N20 MIL-M-38510
OUTPUT LOGIC FORMBIPOLAR METAL-OXIDE SEMICONDUCTOR
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY20 BONDING PAD
MEMORY CAPACITYUNKNOWN
SUBSTITUTES & CROSS-REFERENCES 4
5962-87791Reference document
Same NSN cross-reference
Reference document — Identification reference
5962-87791122XReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-87791122ASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-87791122BReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is GEM12112Q2A?
GEM12112Q2A is a MICROCIRCUIT,MEMORY.
What parts can replace GEM12112Q2A?
There are 4 known substitutes for GEM12112Q2A: 5962-87791, 5962-87791122X, 5962-87791122A and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for GEM12112Q2A?
GEM12112Q2A is cataloged in the U.S. Government catalog under NSN 5962-01-591-1091. This indicates validated use in U.S. government and defense supply chains.
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